Chemical-mechanical polishing process

Details Chemical-mechanical polishing process Chemical-mechanical polishing process

2005-12-06

2005-12-06

Bueker, Richard (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C438S693000, C451S036000, C051S309000, C423S627000

Reexamination Certificate

active

06972096

ABSTRACT:
A chemical-mechanical polishing process for planarizing at least one or more of thin films formed on a substrate, wherein the chemical-mechanical polishing is performed using a slurry containing abrasive particles mainly made of sialon or boehmite. This process is advantageous in improvement of a polishing rate without degradation in planarity of the processed surface and in level of metal impurities.

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CRC Handbook of Chemistry + Physics 54thEd CRC Press, 1974.
Wefers et al. “Oxides and Hydroxides of Aluminum” Alcoa Technical Paper No. 19, Revised, Alcoa Laboratories, 1987.

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