Chemical-mechanical polishing process

Details Chemical-mechanical polishing process Chemical-mechanical polishing process

1996-10-25

1999-05-25

Kunemund, Robert

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

451 36, H01L 2100, B24B 100

Patent

active

059069490

ABSTRACT:
A chemical-mechanical polishing process for planarizing at least one or more of thin films formed on a substrate, wherein the chemical-mechanical polishing is performed using a slurry containing abrasive particles mainly made of sialon or boehmite. This process is advantageous in improvement of a polishing rate without degradation in planarity of the processed surface and in level of metal impurities.

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