Chemical mechanical polishing pads

Details Chemical mechanical polishing pads Chemical mechanical polishing pads

2006-06-05

2009-08-04

Rose, Robert (Department: 3727)

Abrading

Machine

Rotary tool

C451S533000

Reexamination Certificate

active

07568970

ABSTRACT:
The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present invention includes a plurality of solid supports which substantially eliminate the nonuniform polishing rates in known CMP processes and may be tailored to optimize a wide array of CMP processes. The CMP apparatus of the present invention incorporates a deformable pad of the present invention and may include several other known features, such as a polishing pad, a substrate carrier, mechanical assemblies for agitating the polishing pad or substrate carrier, etc. The methods falling within the scope of the present invention include providing a CMP polishing apparatus, providing a deformable pad of the present invention, providing a polishing pad attached to the deformable pad of the present invention, and bringing a substrate having a material layer to be polished in contact with the polishing pad. As will be appreciated by one of skill in the art, the CMP apparatus and the methods of the present invention may be easily adapted for use in virtually all CMP processes.

REFERENCES:
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5564965 (1996-10-01), Tanaka et al.
patent: 5624299 (1997-04-01), Shendon
patent: 5664989 (1997-09-01), Nakata et al.
patent: 5692947 (1997-12-01), Talieh et al.
patent: 5692950 (1997-12-01), Rutherford et al.
patent: 5853317 (1998-12-01), Yamamoto
patent: 5876269 (1999-03-01), Torii
patent: 5899745 (1999-05-01), Kim et al.
patent: 6217426 (2001-04-01), Tolles et al.
patent: 6498101 (2002-12-01), Wang
patent: 6561891 (2003-05-01), Eppert et al.
patent: 6666751 (2003-12-01), Wang
patent: 57023965 (1982-02-01), None
patent: 58045861 (1983-03-01), None
patent: 05505769 (1993-08-01), None
patent: 05285825 (1993-11-01), None
Wang et al.,Von Mises Stress in Chemical-Mechanical Polishing Process, J. Electrochem. Soc., vol. 144, No. 3, Mar. 1997, pp. 1121-1127.

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