Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2005-10-04
2005-10-04
Wilson, Lee D. (Department: 3723)
Abrading
Abrading process
With tool treating or forming
C451S285000, C451S288000, C451S527000
Reexamination Certificate
active
06951510
ABSTRACT:
A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and a groove of a second size, wherein the first and second groove sizes are different relative to one another.
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Rodriguez Jose Omar
Storey Charles A.
Thompson John F.
Agere Systems Inc.
Wilson Lee D.
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