Chemical mechanical polishing pad slurry distribution grooves

Abrading – Flexible-member tool – per se – Interrupted or composite work face

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451285, 451528, 451287, 451533, B24B 100

Patent

active

058822518

ABSTRACT:
Provided is a chemical mechanical polishing pad having grooves in its polishing surface which have a sub-surface cross-sectional span greater than the grooves' surface opening span. In this way, the edges of the groove are undercut. This provides both increased groove volume for a given pad surface area and groove depth, and variable flexibility in the polishing pad's surface. Grooves in pads of the invention also typically include a neck region at the top of the groove, where the groove side walls are substantially parallel. This provides a margin for the pad to wear during polishing without affecting the pad's surface area. The invention also provides a method and apparatus for cutting grooves in a chemical mechanical polishing pad.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5527215 (1996-06-01), Rubino et al.
patent: 5536202 (1996-07-01), Appel et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5609517 (1997-03-01), Lofaro
patent: 5645469 (1997-07-01), Burke et al.
patent: 5664989 (1997-09-01), Nakata et al.
patent: 5807165 (1998-09-01), Uzoh et al.
Unknown Author, "About Bridgeport Machines", Company Information, http://www/bpt.com.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chemical mechanical polishing pad slurry distribution grooves does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical mechanical polishing pad slurry distribution grooves, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical polishing pad slurry distribution grooves will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-812054

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.