Chemical mechanical polishing pad having secondary polishing...

Details Chemical mechanical polishing pad having secondary polishing... Chemical mechanical polishing pad having secondary polishing...

2006-05-19

2010-10-05

Shosho, Callie E (Department: 1787)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

C438S692000, C451S041000, C451S527000, C451S287000

Reexamination Certificate

active

07807252

ABSTRACT:
A chemical mechanical polishing pad (104, 400) that includes a polishing layer (108, 420, 500) having a set of primary grooves (124, 408, 516) formed in a polishing surface (110, 428, 520) of the pad. The pad also includes a set of secondary grooves (128, 404, 504) that become selectively active as a function of the wear of the polishing layer from polishing.

REFERENCES:
patent: 5725420 (1998-03-01), Torii
patent: 6331137 (2001-12-01), Raeder et al.
patent: 6951506 (2005-10-01), Andideh et al.
patent: 2002/0004357 (2002-01-01), Baker et al.
patent: 2004/0259479 (2004-12-01), Sevilla

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