Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2008-10-17
2011-12-27
Morgan, Eileen P. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S041000, C451S056000, C451S059000, C451S283000, C451S287000, C451S527000, C451S530000, C451S533000, C051S293000, C051S297000
Reexamination Certificate
active
08083570
ABSTRACT:
A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.
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String Darrell
Turley Jon William
Deibert Thomas S.
Morgan Eileen P.
Rohm and Haas Electronic Materials CMP Holdings Inc.
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