Chemical mechanical polishing pad having holes and or grooves

Details Chemical mechanical polishing pad having holes and or grooves Chemical mechanical polishing pad having holes and or grooves

2005-04-05

2005-04-05

Rose, Robert A. (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S530000

Reexamination Certificate

active

06875096

ABSTRACT:
Disclosed is a chemical mechanical polishing pad formed with holes, grooves or a combination thereof. The chemical mechanical polishing pad is characterized in that a plurality of concentric circles each having grooves, holes, or a combination thereof are formed at a polishing surface of the polishing pad. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

REFERENCES:
patent: 5020283 (1991-06-01), Tuttle
patent: 5297364 (1994-03-01), Tuttle
patent: 5329734 (1994-07-01), Yu
patent: 5984769 (1999-11-01), Bennett et al.
patent: 6165904 (2000-12-01), Kim
patent: 6238271 (2001-05-01), Cesna
patent: 6656019 (2003-12-01), Chen et al.

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