Chemical mechanical polishing pad having a process-dependent...

Details Chemical mechanical polishing pad having a process-dependent... Chemical mechanical polishing pad having a process-dependent...

2005-01-18

2005-01-18

Nguyen, George (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S921000, C451S533000, C451S537000

Reexamination Certificate

active

06843711

ABSTRACT:
A polishing body, e.g., pad (200, 230, 260, 300) or belt (400, 500) having a polishing layer (214, 404) that includes a backmixing region (202, 232, 262, 308, 416, 508) wherein backmixing can occur within a slurry (116) between a wafer (204, 234, 264, 304, 408), or other article, and the polishing layer under certain conditions. The polishing layer includes a first groove configuration (206, 236, 266, 312, 428, 504) within the backmixing region and a second grove configuration (208, 238, 268, 320, 432, 520) outside of the backmixing region that is different from the first groove configuration. The first groove configuration is designed based upon whether or not the presence of spent slurry within the backmixing region is detrimental or beneficial to polishing the wafer.

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patent: 6783436 (2004-08-01), Muldowney

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