Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1997-08-18
2000-07-25
Bueker, Richard
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
451285, 451 5, 451 41, 451443, C23F 102
Patent
active
060932805
ABSTRACT:
A conditioning wafer for conditioning a polishing pad employed in chemical-mechanical polishing of an integrated circuit substrate is described. The conditioning wafer includes a disk having a conditioning surface and a plurality of abrasive particles secured on the conditioning surface of the disk. Furthermore, the abrasive particles engage with the polishing pad when the conditioning wafer contacts the polishing pad during conditioning of the polishing pad.
REFERENCES:
patent: 4558542 (1985-12-01), Marton
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5245790 (1993-09-01), Jerbic
patent: 5265378 (1993-11-01), Rostoker
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5321304 (1994-06-01), Rostoker
patent: 5389194 (1995-02-01), Rostoker et al.
patent: 5403228 (1995-04-01), Pasch
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5516400 (1996-05-01), Pasch et al.
patent: 5536202 (1996-07-01), Appel
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5595526 (1997-01-01), Yau et al.
patent: 5597443 (1997-01-01), Hempel
patent: 5624304 (1997-04-01), Pasch et al.
patent: 5626715 (1997-05-01), Rostoker
patent: 5667433 (1997-09-01), Mallon
patent: 5823854 (1998-10-01), Chen
patent: 5861055 (1999-01-01), Allman et al.
patent: 5865666 (1999-02-01), Nagahara
patent: 5868608 (1999-02-01), Allman et al.
patent: 5882251 (1999-03-01), Berman et al.
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5888120 (1999-03-01), Doran
patent: 5893756 (1999-04-01), Berman et al.
patent: 5921856 (1999-07-01), Zimmer
patent: 5948697 (1999-09-01), Hata
patent: 5957757 (1999-09-01), Berman
Kalpathy-Cramer Jayashree
Kirchner Eric J.
Bueker Richard
LSI Logic Corporation
Torres Norca L.
LandOfFree
Chemical-mechanical polishing pad conditioning systems does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemical-mechanical polishing pad conditioning systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-mechanical polishing pad conditioning systems will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1333999