Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component
Reexamination Certificate
2007-01-29
2009-08-04
Vo, Hai (Department: 1794)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Composite having voids in a component
C428S315500, C428S315700, C428S317900, C451S526000, C451S527000
Reexamination Certificate
active
07569268
ABSTRACT:
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has an ultimate tensile strength of at least 3,000 psi (20.7 MPa) and polymeric matrix containing closed cell pores. The closed cell pores have an average diameter of 1 to 50 μm and represent 1 to 40 volume percent of the polishing pad. The pad texture has an exponential decay constant, τ, of 1 to 10 μm as a result of the natural porosity of the polymeric matrix and a surface texture developed by implementing periodic or continuous conditioning with an abrasive. The surface texture has a characteristic half height half width, W1/2that is less than or equal to the value of τ.
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Chemical-Mechanical Planarization of Semiconductor Materials, edited by M. R. Oliver, Springer, New York, NY, 2004, pp. 204-206.
Crkvenac T. Todd
Fawcett Clyde A.
Kulp Mary Jo
Lawing Andrew Scott
Prygon Kenneth A.
Biederman Blake T.
Rohm and Haas Electronic Materials CMP Holdings Inc.
Vo Hai
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