Stock material or miscellaneous articles – Composite – Of polyamidoester
Reexamination Certificate
2006-05-25
2008-11-04
Ahmed, Sheeba (Department: 1794)
Stock material or miscellaneous articles
Composite
Of polyamidoester
C451S526000, C451S527000
Reexamination Certificate
active
07445847
ABSTRACT:
The invention provides a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix having a top polishing surface. The top polishing surface has polymeric polishing asperities or forms polymeric polishing asperities upon conditioning with an abrasive. The polymeric polishing asperities are from a polymeric material having at least 45 weight percent hard segment and a bulk ultimate tensile strength of at least 6,500 psi (44.8 MPa). And the polymeric matrix has a two phase structure, a hard phase and a soft phase with an average area of the hard phase to average area of the soft phase ratio of less than 1.6.
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Szycher, Michael; Szycher's Handbook of Polyurethanes, 1999, pp. 11-1:11-23, CRC Press LLC, USA.
Ahmed Sheeba
Biederman Blake T.
Rohm and Haas Electronic Materials CMP Holdings Inc.
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