Chemical mechanical polishing pad

Details Chemical mechanical polishing pad Chemical mechanical polishing pad

2006-12-21

2008-10-21

Eley, Timothy V (Department: 3724)

Abrading

Flexible-member tool, per se

Laminate

C051S298000, C051S307000

Reexamination Certificate

active

07438636

ABSTRACT:
A chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix. The high modulus component has a modulus of at least 100 MPa. The impact modifier includes a low modulus component having a modulus of at least one order of magnitude less than the high modulus component that increases the impact resistance of the polishing pad.

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