Chemical mechanical polishing pad

Details Chemical mechanical polishing pad Chemical mechanical polishing pad

2007-01-30

2007-01-30

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S526000

Reexamination Certificate

active

11442076

ABSTRACT:
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix having a top polishing surface; and the top polishing surface has polymeric polishing asperities or forms polymeric polishing asperities upon conditioning with an abrasive. The polymeric polishing asperities extend from the polymeric matrix and represent the portion of the top polishing surface that can contact a substrate during polishing. The polymeric polishing asperities are from a polymeric material having a bulk ultimate tensile strength of at least 6,500 psi (44.8 MPa) and a bulk tear strength of at least 250 lb/in. (4.5×103g/mm).

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