Chemical mechanical polishing pad

Details Chemical mechanical polishing pad Chemical mechanical polishing pad

2006-08-29

2006-08-29

Morgan, Eileen P. (Department: 3723)

Abrading

Flexible-member tool, per se

C451S527000, C451S533000, C451S530000

Reexamination Certificate

active

07097550

ABSTRACT:
A chemical mechanical polishing pad which can be advantageously used for the polishing of a metal film or the polishing of an insulating film, provides a flat polished surface, enables slurry to be efficiently removed, has sufficiently long service life, can provide a high polishing rate and has the effect of reducing the number of scratches. This polishing pad has one or more grooves on its polishing surface, wherein the groove(s) is/are formed in the polishing surface in such a manner that it/they intersect(s) a single virtual straight line extending from the center portion toward the peripheral portion of the polishing surface a plurality of times and has/have a width of 0.1 to 1.5 mm and a depth of 0.9 to 9.8 mm, the shortest distance between adjacent intersections between it/them and the virtual straight line is 0.3 to 2.0 mm, and the ratio of the depth of the groove(s) to the thickness of the polishing pad is 1/7 to 1/1.1.

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