Chemical-mechanical polishing pad

Details Chemical-mechanical polishing pad Chemical-mechanical polishing pad

1999-01-04

2000-09-19

Butler, Rodney A.

Abrading

Rigid tool

Rotary disk

451 41, B23F 2103, B24B 100

Patent

active

061203661

ABSTRACT:
The invention provides a chemical-mechanical polishing pad, which includes a plurality of annular grooves and a plurality of streamline grooves designed according to principles of the hydrodynamics. The streamline grooves of polishing pad are designed according to flow equations derived from source flow and vortex flow, and the streamline grooves of polishing pad uniformly distribute the slurry on the polishing pad. An angle and a depth of the streamline groove, which are calculated by boundary layer effect of the streamline groove function, are used to design an optimum structure for polishing pad.

REFERENCES:
patent: 5645469 (1997-07-01), Burke et al.
patent: 5782682 (1998-07-01), Han et al.
patent: 5888121 (1999-03-01), Kirchner et al.
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 5984769 (1999-11-01), Bennett et al.

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