Chemical-mechanical polishing of thin materials using non-baked

Details Chemical-mechanical polishing of thin materials using non-baked Chemical-mechanical polishing of thin materials using non-baked

1995-02-10

1998-06-23

Rose, Robert A.

Abrading

Machine

Rotary tool

451285, 451286, 451288, 451289, 451 41, 451 57, 451 66, B24B 500

Patent

active

057696969

ABSTRACT:
Planarization of a patterned semiconductor wafer is effected by chemical-mechanical polishing using a carrier assembly comprising a carrier film adhesively bonded to a base plate, preferably by a pressure sensitive adhesive. Chemical-mechanical polishing is preferably conducted employing three phases of different pressures to prevent wafer slippage.

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Ali, Iqbal et al, "Chemical-Mechanical Polishing of Interlayer Dielectric: A Review", Solid State Technology, Oct. 1994, pp. 63-68.
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