Chemical-mechanical polishing methods

Details Chemical-mechanical polishing methods Chemical-mechanical polishing methods

2008-07-22

2008-07-22

Culbert, Roberts (Department: 1792)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

Reexamination Certificate

active

07402259

ABSTRACT:
A chemical-mechanical polishing (CMP) method includes applying a solid abrasive material to a substrate, polishing the substrate, flocculating at least a portion of the abrasive material, and removing at least a majority portion of the flocculated portion from the substrate. Applying solid abrasive material can include applying a CMP slurry or a polishing pad comprising abrasive material. Such a method can further include applying a surfactant comprising material to the substrate to assist in effectuating flocculation of the abrasive material. Such surfactant comprising material may be cationic which includes, for example, a quaternary ammonium substituted salt. Also, for example, the surfactant comprising material may be applied during polishing, brush scrubbing, pressure spraying, or buffing.

REFERENCES:
patent: 4050954 (1977-09-01), Basi
patent: 5049200 (1991-09-01), Brunner et al.
patent: 5078801 (1992-01-01), Malik
patent: 5704987 (1998-01-01), Huynh et al.
patent: 5750440 (1998-05-01), Vanell et al.
patent: 5855811 (1999-01-01), Grieger et al.
patent: 5858813 (1999-01-01), Scherber et al.
patent: 5996594 (1999-12-01), Roy et al.
patent: 6039891 (2000-03-01), Kaufman et al.
patent: 6044851 (2000-04-01), Grieger et al.
patent: 6152148 (2000-11-01), George et al.
patent: 6258140 (2001-07-01), Shemo et al.
patent: 6265781 (2001-07-01), Andreas
patent: 6345630 (2002-02-01), Fishkin et al.
patent: 6835121 (2004-12-01), Andreas

Affiliated with

Also associated with

Rating

Chemical-mechanical polishing methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical-mechanical polishing methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-mechanical polishing methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2746957