Chemical mechanical polishing method, polisher used in chemical

Details Chemical mechanical polishing method, polisher used in chemical Chemical mechanical polishing method, polisher used in chemical

1997-09-26

1999-11-09

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

216 88, 216 89, 438693, 156345, H01L 2100

Patent

active

059813946

ABSTRACT:
The present invention provides the chemical-mechanical polishing method having the step of subjecting a film to be polished, provided on a main surface of a substrate, and having a projection portion and a recess portion on a surface thereof, to polishing and etching, wherein the projection portion of the film to be polished is mechanically polished and chemically etched while covering the recess portion with a protective film to protect it from being chemically etched by supplying a protecting agent on the film to be polished.

REFERENCES:
patent: 5491113 (1996-02-01), Murota
patent: 5494857 (1996-02-01), Cooperman et al.
patent: 5688720 (1997-11-01), Hayashi
patent: 5880003 (1999-03-01), Hayashi

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