Chemical/mechanical polishing method for STI

Details Chemical/mechanical polishing method for STI Chemical/mechanical polishing method for STI

2007-01-16

2007-01-16

Shakeri, Hadi (Department: 3723)

Abrading

Abrading process

Combined abrading

C451S037000

Reexamination Certificate

active

10833089

ABSTRACT:
A chemical/mechanical polishing method for polishing an object to be polished with an irregular surface, having a substrate with convexities and concavities, a stopper layer formed on the convexities of the substrate, and an embedded insulating layer formed to cover the concavities of the substrate and the stopper layer, wherein the method is characterized comprising a first polishing step of flattening the embedded insulating layer using a slurry (A) which can maintain the polishing speed at 500 Å/min or less and a second polishing step of further polishing the embedded insulating layer to cause the stopper layer on the convexities to be exposed using a slurry (B) which can maintain the polishing speed at 600 Å/min or more. The method is useful for flattening wafers during shallow trench isolation (STI) in manufacturing semiconductor devices.

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