Chemical mechanical polishing method for reducing slurry reflux

Details Chemical mechanical polishing method for reducing slurry reflux Chemical mechanical polishing method for reducing slurry reflux

2005-01-18

2005-01-18

Nguyen, George (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S005000, C451S006000, C451S285000, C451S287000

Reexamination Certificate

active

06843709

ABSTRACT:
A method of polishing a surface (120) of an article, e.g., a semiconductor wafer (112, 212), using a polishing layer (108, 208) in the presence of a polishing medium, such as a slurry (116). The method includes selecting the rotational rate of the article or the velocity of the polishing layer, or both, so as to control either removal rate uniformity or the occurrence of defects on the polished surface, or both.

REFERENCES:
patent: 5020283 (1991-06-01), Tuttle
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5645469 (1997-07-01), Burke et al.
patent: 5674109 (1997-10-01), Kanzawa et al.
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 5990012 (1999-11-01), Robinson et al.
patent: 6159088 (2000-12-01), Nakajima
patent: 6273806 (2001-08-01), Bennett et al.
patent: 6354919 (2002-03-01), Chopra
patent: 6520847 (2003-02-01), Osterheld et al.
patent: 6602436 (2003-08-01), Mandigo et al.
patent: 6652354 (2003-11-01), Hayashi et al.

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