Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2006-05-16
2006-05-16
Eley, Timothy V. (Department: 3724)
Abrading
Abrading process
Glass or stone abrading
C451S063000, C451S288000
Reexamination Certificate
active
07044838
ABSTRACT:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity. A method for polisihing and a semiconductor manufacture is also provided.
REFERENCES:
patent: 5679065 (1997-10-01), Henderson
patent: 5941758 (1999-08-01), Mack
patent: 6033292 (2000-03-01), Inaba
patent: 6110025 (2000-08-01), Williams et al.
patent: 6116992 (2000-09-01), Prince
patent: 6139428 (2000-10-01), Drill et al.
Chin Scott
Dickey Tanlin K.
Dyson, Jr. William
Geraghty John J.
Maloney Gerard S.
Dorsey & Whitney LLP
EBARA Corporation
Eley Timothy V.
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