Chemical mechanical polishing equipment and conditioning...

Details Chemical mechanical polishing equipment and conditioning... Chemical mechanical polishing equipment and conditioning...

2006-03-07

2006-03-07

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000

Reexamination Certificate

active

07008302

ABSTRACT:
A chemical mechanical polishing equipment has a polishing pad, a holder, a slurry supply and a conditioner. The holder is disposed above the polishing pad and carries a wafer for polishing the surface of wafer. The slurry supply is disposed above the polishing pad for supplying slurry onto the polishing surface. The conditioner is disposed near the polishing pad for removing the residual particles over the polishing pad. By disposing a plurality of block on the conditioner, the conditioner can provide with flexibility so that the conditioner can sufficiently contact with the polishing surface for increasing the removal rate of residual particles.

REFERENCES:
patent: 6106371 (2000-08-01), Nagahara et al.
patent: 6190243 (2001-02-01), Wada et al.
patent: 6371838 (2002-04-01), Holzapfel
patent: 6419559 (2002-07-01), Gurusamy et al.
patent: 6500054 (2002-12-01), Ma et al.
patent: 6672949 (2004-01-01), Chopra et al.
patent: 6682404 (2004-01-01), Brunelli
patent: 6752698 (2004-06-01), Renteln et al.
patent: 6764389 (2004-07-01), Butterfield et al.

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