Chemical mechanical polishing end point detection apparatus...

Details Chemical mechanical polishing end point detection apparatus... Chemical mechanical polishing end point detection apparatus...

2007-01-30

2007-01-30

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S005000

Reexamination Certificate

active

11275715

ABSTRACT:
Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing pad structure that rotates the polishing pad over the surface of the wafer. The apparatus also includes a measuring device which is capable of continuously measuring the surface of the wafer during polishing of the surface of the wafer.

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http:/www.verityinst.com.html, Verity Instruments, Inc. Company Profile, Press Release, and Products.
Verity Instruments, Inc., Applications Information.

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