Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2007-12-04
2007-12-04
Marcheschi, Michael (Department: 1755)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C051S307000, C051S308000, C051S309000, C106S003000, C106S005000, C438S693000, C216S105000, C216S106000
Reexamination Certificate
active
10882568
ABSTRACT:
The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
REFERENCES:
patent: 6117775 (2000-09-01), Kondo et al.
patent: 6326299 (2001-12-01), Homma et al.
patent: 6562719 (2003-05-01), Kondo et al.
patent: 6585568 (2003-07-01), Tsuchiya et al.
patent: 6605537 (2003-08-01), Bian et al.
patent: 6620037 (2003-09-01), Kaufman et al.
patent: 6632259 (2003-10-01), Weinstein et al.
patent: 6679928 (2004-01-01), Costas et al.
patent: 2003/0181345 (2003-09-01), Bian
patent: 2003/0219982 (2003-11-01), Kurata et al.
patent: 2004/0023492 (2004-02-01), Bian et al.
patent: 2004/0229461 (2004-11-01), Darsillo et al.
patent: 1 211 717 (2002-06-01), None
patent: 1 223 609 (2002-07-01), None
patent: WO 99/64527 (1999-12-01), None
patent: WO 01/14496 (2001-03-01), None
patent: WO 02/094957 (2002-11-01), None
Kelley Francis J.
Quanci John
So Joseph K.
Wang Hongyu
Biederman Blake T.
Marcheschi Michael
Rohm and Haas Electronic Materials CMP Holdings Inc.
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