Chemical mechanical polishing compositions and methods...

Details Chemical mechanical polishing compositions and methods... Chemical mechanical polishing compositions and methods...

2005-06-07

2005-06-07

Marcheschi, Michael (Department: 1755)

Abrasive tool making process, material, or composition

With synthetic resin

C106S003000, C051S293000

Reexamination Certificate

active

06902590

ABSTRACT:
A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

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