Chemical-mechanical polishing (CMP) slurry containing clay...

Details Chemical-mechanical polishing (CMP) slurry containing clay... Chemical-mechanical polishing (CMP) slurry containing clay...

2006-09-26

2006-09-26

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S028000, C451S285000

Reexamination Certificate

active

07112123

ABSTRACT:
A composition for planarizing or polishing a surface comprising (a) a liquid carrier, and (b) solids comprising about 0.1 to about 10% by weight clay abrasive particles, and about 0.1% to about 50% by weight CeO2particles, based on the total weight of solids in the composition, said clay and CeO2abrasive particles having a particle size such that at least 90% of the particles (by number), when slurried in water, have a particle size in the range of about 10 nm to about 10 μm.

REFERENCES:
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patent: 6602439 (2003-08-01), Hampden-Smith et al.
patent: 6841480 (2005-01-01), Simpson et al.
patent: 6976905 (2005-12-01), Fang et al.
patent: 2004/0224622 (2004-11-01), Sakurai et al.
patent: 2005/0277367 (2005-12-01), Fang et al.
patent: WO-2004/063301 (2004-07-01), None
PCT International Search Report from the European Patent Office for International Patent Application No. PCT/US2005/02716 dated Sep. 23, 2005 (2 pages).

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