Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2006-08-08
2006-08-08
Norton, Nadine G. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C051S307000, C051S308000, C051S298000, C210S631000, C424S443000
Reexamination Certificate
active
07087529
ABSTRACT:
A chemical-mechanical abrasive composition for use in semiconductor processing uses abrasive particles having a non-spherical morphology.
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Eisenhour Don D.
Fang Mingming
Ianiro Michael R.
Amcol International Corporation
George Patricia
Marshall & Gerstein & Borun LLP
Norton Nadine G.
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