Chemical mechanical polishing aqueous dispersion and...

Details Chemical mechanical polishing aqueous dispersion and... Chemical mechanical polishing aqueous dispersion and...

2005-08-30

2005-08-30

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C438S692000

Reexamination Certificate

active

06935928

ABSTRACT:
A chemical mechanical polishing aqueous dispersion comprises a component (A) composed of abrasive grains, a component (B) composed of at least one of quinolinecarboxylic acid and pyridinecarboxylic acid, a component (C) composed of an organic acid other than quinolinecarboxylic acid and pyridinecarboxylic acid and a component (D) composed of an oxidizing agent, wherein a mass ratio (WB/WC) of the content (WB) of the component (B) to the content (WC) of the component (C) is not less than 0.01 and less than 2, and the concentration of an ammonia component composed of ammonia and ammonium ion is not more than 0.005 mol/litter. According to the chemical mechanical polishing aqueous dispersion, various layers to be processed can be polished with high efficiency, and a sufficiently planarized polished surface of high precision can be obtained.

REFERENCES:
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patent: 2003/0153183 (2003-08-01), Konno et al.
patent: 2004/0067649 (2004-04-01), Hellring et al.
patent: 2004/0162011 (2004-08-01), Konno et al.
patent: 2001-196336 (2001-07-01), None
patent: 2002-110597 (2002-04-01), None
patent: 2002-151451 (2002-05-01), None

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