Chemical mechanical polishing apparatus with improved substrate

Details Chemical mechanical polishing apparatus with improved substrate Chemical mechanical polishing apparatus with improved substrate

1998-10-19

2000-10-24

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, H01L 21302

Patent

active

061367109

ABSTRACT:
An improved and new substrate carrier head for use in a CMP apparatus is described. The new substrate carrier head has a substrate retaining ring with embedded intersecting channels in the outer face. The embedded intersecting channels improve the circulation of polishing slurry to and from the polished substrate and polishing byproducts away from the polished substrate and thereby improve the polishing uniformity on the substrate.

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