Chemical mechanical polishing apparatus having a stepped...

Details Chemical mechanical polishing apparatus having a stepped... Chemical mechanical polishing apparatus having a stepped...

2005-07-12

2005-07-12

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000, C451S059000, C451S063000, C451S288000, C451S398000

Reexamination Certificate

active

06916226

ABSTRACT:
A chemical mechanical processing apparatus includes a polishing pad capable of polishing a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bottom side, the open region providing space for pad rebound, the open region further having a plurality of tips to hold a substrate in position during rotation of the substrate against the polishing pad, the stepped retaining ring capable of rotating the substrate against the polishing pad; and a dispenser capable of dispensing a slurry onto the pad.

REFERENCES:
patent: 6089961 (2000-07-01), Cesna et al.
patent: 6224472 (2001-05-01), Lai et al.
patent: 6267655 (2001-07-01), Weldon et al.
patent: 6419567 (2002-07-01), Glashauser
patent: 6454637 (2002-09-01), Gotkis
patent: 6602116 (2003-08-01), Prince
patent: 6716299 (2004-04-01), Gotkis et al.

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