Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2005-08-02
2005-08-02
Hail, III, Joseph J. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S289000
Reexamination Certificate
active
06923709
ABSTRACT:
A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.
REFERENCES:
patent: 5938884 (1999-08-01), Hoshizaki et al.
patent: 6352466 (2002-03-01), Moore
patent: 6390908 (2002-05-01), Chen et al.
patent: 6626734 (2003-09-01), Moore
Chen Chih-Kun
Chen Ching-Huang
Wang Shan-Chang
Grant Alvin J
Ladas & Parry LLP
Nanya Technology Corporation
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