Chemical mechanical polishing apparatus for semiconductor wafer

Details Chemical mechanical polishing apparatus for semiconductor wafer Chemical mechanical polishing apparatus for semiconductor wafer

1996-11-26

1998-01-13

Rose, Robert A.

Abrading

Machine

Rotary tool

451286, 451287, 451288, 451289, 451 41, 451290, 451177, 451178, B24B 500

Patent

active

057072744

ABSTRACT:
A chemical mechanical polishing apparatus for a semiconductor wafer which is capable of polishing uniformly the surface of the semiconductor wafer and of controlling the polishing amount by providing plurality of rotary drums each wrapped in a polishing cloth on the upper surface of a polishing pad and connecting supporters capable of vertical movement to both ends each rotary drum, and includes a rotatable polishing pad in the planar upper surface of which a plurality of recesses are formed for receiving a semiconductor wafer, a plurality of rotatable polishing units located on the polishing pad for planarizing the surface of the semiconductor wafers, a supporter connected at the endpoints of the rotational polishing units which can make a vertical movement, and a slurry applicator located above the rotational polishing units for putting a slurry thereon.

REFERENCES:
patent: 5232875 (1993-08-01), Tuttle et al.

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