Chemical mechanical polishing apparatus for controlling slurry d

Details Chemical mechanical polishing apparatus for controlling slurry d Chemical mechanical polishing apparatus for controlling slurry d

1999-09-10

2000-05-16

Banks, Derris Holt

Abrading

Accessory

Abradant supplying

451 60, 451 41, B24B 5700

Patent

active

060629649

ABSTRACT:
A chemical mechanical polishing apparatus for controlling slurry distribution is disclosed. The slurry flowing through the mesh before transferring to the polishing pad, the mesh being used to distribute the slurry onto surface of the polishing pad. There are different netting densities over the mesh, achieving the purpose of controlling slurry distribution.

REFERENCES:
patent: 4490948 (1985-01-01), Hanstein et al.
patent: 5554064 (1996-09-01), Breivogel et al.
patent: 5658185 (1997-08-01), Morgan, III et al.
patent: 5816900 (1998-10-01), Nagahara et al.
patent: 5876271 (1999-03-01), Oliver

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