Chemical mechanical polishing apparatus and method of...

Details Chemical mechanical polishing apparatus and method of... Chemical mechanical polishing apparatus and method of...

2005-10-04

2005-10-04

Wilson, Lee D. (Department: 3723)

Abrading

Machine

Rotary tool

C451S041000, C451S060000

Reexamination Certificate

active

06951512

ABSTRACT:
There is provided an apparatus for polishing a substrate, including (a) a polishing pad formed with a plurality of through-holes through which polishing material is supplied to a surface of the polishing pad, (b) a level block on which the polishing pad is mounted, and (c) a rotatable carrier for supporting a substrate thereon, the carrier being positioned in facing relation with the level block, the level block being rotatable around a rotation axis thereof with the rotation axis being moved along an arcuate path, and causing the polishing pad to make contact with the substrate for polishing the substrate, the polishing pad having a first ring-shaped region concentric thereto where no through-holes are formed. For instance, the first ring-shaped region has a width greater than 10%, but smaller than 95% of a radius of the polishing pad. The apparatus enhances uniformity in polishing a substrate.

REFERENCES:
patent: 3968598 (1976-07-01), Ogawa
patent: 5329734 (1994-07-01), Yu
patent: 5554064 (1996-09-01), Breivogel et al.
patent: 5672095 (1997-09-01), Morimoto et al.
patent: 5800248 (1998-09-01), Pant et al.
patent: 5853317 (1998-12-01), Yamamoto
patent: 5944583 (1999-08-01), Cruz et al.
patent: 5957750 (1999-09-01), Brunelli
patent: 5964646 (1999-10-01), Kassir et al.
patent: 513389 (1993-01-01), None
patent: 301772 (1997-04-01), None

Affiliated with

Also associated with

Rating

Chemical mechanical polishing apparatus and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical mechanical polishing apparatus and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical polishing apparatus and method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3476798