Chemical mechanical polishing apparatus and method

Details Chemical mechanical polishing apparatus and method Chemical mechanical polishing apparatus and method

1997-07-15

2000-04-04

Gulakowski, Randy

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

438692, 438693, B44C 122

Patent

active

060457163

ABSTRACT:
Technique including a method 400 and an apparatus 100 for chemical mechanical polishing using a plurality of carrier devices 123 rotatably coupled to a turret means. The apparatus 100 includes a turret and plurality of rotatable polishing surfaces 111 positioned around the turret. The apparatus also includes a plurality of carrier devices 123 rotatably coupled to the turret, where the carrier devices 123 are each adapted to hold a workpiece to be polished on at least one of the rotatable polishing surfaces. Each of the carrier devices is operably independently to each other during a process for chemical mechanical polishing.

REFERENCES:
patent: 5804507 (1998-09-01), Perlov et al.

Affiliated with

Also associated with

Rating

Chemical mechanical polishing apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical mechanical polishing apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical polishing apparatus and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-361725