Abrading – Precision device or process - or with condition responsive... – Controlling temperature
Reexamination Certificate
2007-07-03
2007-07-03
Morgan, Eileen P. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Controlling temperature
C451S041000, C451S053000, C451S287000
Reexamination Certificate
active
11265611
ABSTRACT:
Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing head for holding the wafer, a platen, a polishing pad at a top of the platen so as to polish the wafer, and a heat conduction medium on or in the polishing pad and configured to diffuse heat of the polishing pad such that the temperature distribution of the polishing pad may become substantially uniform.
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patent: 2001-0062114 (2001-07-01), None
Monoocher Birang, Ramin Emami, Shijian Li and Fred C. Redeker; Thermal Preparatory State Regulation for Fixed Abrasive Product; English Abstract of Korean Patent Publication; 1020010062114 A; Jul. 7, 2001; Korean Intellectual Property Office, Republic of Korea.
Dongbu Electronics Co. Ltd.
Fortney Andrew D.
Morgan Eileen P.
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