Chemical-mechanical polishing apparatus

Details Chemical-mechanical polishing apparatus Chemical-mechanical polishing apparatus

1998-05-27

2000-01-04

Scherbel, David A.

Abrading

Machine

Rotary tool

451527, B24B 500

Patent

active

060103957

ABSTRACT:
Disclosed is a chemical-mechanical polishing apparatus having a polishing cloth enabling planarization in which occurrence of mictoscracthes is suppressed without the need of provision of a dressing step. The apparatus basically includes a turn table on which a polishing cloth is mounted, a holding base for holding a substrate to be processed, and a polishing solution supply unit. The surface of the polishing cloth has irregularities formed by arranging a large number of truncated cone-shaped small holes in a delta-shaped pattern at specific intervals. The depth of the small holes is set at about 800 .mu.m and the interval is set at about 300 .mu.m. Such an apparatus is effective to improve the yield in fabrication of highly integrated semiconductor devices using the apparatus at a planarization step.

REFERENCES:
patent: 5297364 (1994-03-01), Tuttle
patent: 5329734 (1994-07-01), Yu
patent: 5672095 (1997-09-01), Morimoto et al.
patent: 5795218 (1998-08-01), Doan et al.
patent: 5853317 (1998-12-01), Yamamoto

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