Chemical-mechanical polisher hardware design

Details Chemical-mechanical polisher hardware design Chemical-mechanical polisher hardware design

2006-05-30

2006-05-30

McDonald, Shantese (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S060000, C451S063000, C451S287000, C451S288000, C451S289000, C451S262000

Reexamination Certificate

active

07052372

ABSTRACT:
A polish apparatus for planarizing wafers and films over wafers comprising the following. A substrate chuck for holding a substrate with a surface to be polished thereof being directed about vertically. A first drive means for rotating the substrate chuck. A polishing head having a polishing surface which is adjacent to the substrate during the polishing of the substrate. The polishing surface of the polishing head is smaller than the surface of the substrate. A polishing solution supply means for supplying a polishing solution through the polishing head to the substrate held by the substrate chuck. A reciprocating means for reciprocally moving the polishing head on the surface to be polished. A pressing means for pressing the polishing pad against a substrate held by the substrate chuck by way of the polishing head. The polish head is preferably comprised of one piece of molded polymer. No polish pad is used.

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