Chemical mechanical polish platen and method of use

Details Chemical mechanical polish platen and method of use Chemical mechanical polish platen and method of use

1997-10-09

2000-05-02

Rose, Robert A.

Abrading

Machine

Rotary tool

451 57, B24B 722

Patent

active

060566310

ABSTRACT:
The present disclosure relates to a chemical mechanical polishing apparatus used for polishing wafers. The apparatus includes a polish platen and structure for separating the platen into at least first and second zones such that polishing fluid used in the first zone is prevented from entering the second zone.

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Ali et al., "Chemical-mechanical polishing of interlayer dielectric: A review," Solid State Technology, 5 pgs. (Oct. 1994).
Cook et al., "Theoretical and Practical Aspects of Dielectric and Metal CMP," Semiconductor International, 3 pgs. (Nov. 1995).
DeJule, "Advances in CMP," Semiconductor International, pp. 88-96 (Nov. 1996).
Kim et al., "Optimized Process Developed For Tungsten CMP," Semiconductor International, 4 pgs. (Nov. 1996).
IBM Technical Disclosure Bulletin, Hause, et al, "Wafer Polishing Process", vol. 20, No. 9, Feb. 1978.

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