Chemical-mechanical polish (CMP) pad conditioner

Details Chemical-mechanical polish (CMP) pad conditioner Chemical-mechanical polish (CMP) pad conditioner

1998-03-02

1999-11-16

Breneman, Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

451 41, 451 36, H01L 21302

Patent

active

059850930

ABSTRACT:
An improved and new apparatus and process for conditioning a chemical-mechanical polishing (CMP) pad has been developed, wherein sufficient conditioning is assured in order to restore the "fresh pad" polish removal rate performance of the polishing pad, while at the same time prolong the life of the CMP polishing pad. The result is a lower cost process and improved product throughput for the CMP apparatus.

REFERENCES:
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5595526 (1997-01-01), Yau et al.

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