Chemical mechanical polish (CMP) endpoint detection by colorimet

Details Chemical mechanical polish (CMP) endpoint detection by colorimet Chemical mechanical polish (CMP) endpoint detection by colorimet

1997-07-30

2000-09-12

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

216 38, 216 84, 438 8, 438 14, H01L 2100

Patent

active

061177776

ABSTRACT:
A method for fabricating a microelectronics fabrication. There is first provided a substrate employed within a microelectronics fabrication. There is then formed over the substrate a planarizable layer. The planarizable layer has a lower residual portion of the planarizable layer and an upper removable portion of the planarizable layer, where one of the lower residual portion of the planarizable layer and the upper removable portion of the planarizable layer has a colorant incorporated therein. The colorant is positioned at a location which assists in monitoring and controlling an endpoint of a chemical mechanical polish (CMP) planarizing method employed in planarizing the planarizable layer. There is then planarized through the chemical mechanical polish (CMP) planarizing method the planarizable layer while employing the colorant concentration to determine the endpoint of the chemical mechanical polish (CMP) planarizing method.

REFERENCES:
patent: 4838697 (1989-06-01), Kurandt
patent: 5234868 (1993-08-01), Cote
patent: 5240552 (1993-08-01), Vu et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5736427 (1998-04-01), Henderson
patent: 5736462 (1998-04-01), Takahashi et al.
patent: 5798302 (1998-08-01), Hudson et al.

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