Chemical mechanical planarization tool having a linear polishing

Details Chemical mechanical planarization tool having a linear polishing Chemical mechanical planarization tool having a linear polishing

1997-05-29

1999-10-19

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 6, 451288, 451 60, 451 63, 451446, 451289, B24B 100

Patent

active

059678810

ABSTRACT:
A tool is provided for polishing, planarizing, cleaning or otherwise processing silicon wafers or other workpieces. It comprises a cylindrical roller mounted on a spindle above a platform or workstation on which a wafer is mounted. The roller is movable into and out of contact with the wafer, and is rotatable to polish the wafer. The wafer may also be rotatable and translatable on the platform. The roller has a linear region of contact with the wafer during processing operations.

REFERENCES:
patent: 3583110 (1971-06-01), Scott
patent: 4728552 (1988-03-01), Jensen, Jr.
patent: 4805348 (1989-02-01), Arai et al.
patent: 4811522 (1989-03-01), Gill
patent: 5036625 (1991-08-01), Gosis
patent: 5083401 (1992-01-01), Yamashita et al.
patent: 5099614 (1992-03-01), Arai et al.
patent: 5128281 (1992-07-01), Dyer et al.
patent: 5203067 (1993-04-01), DeFazio
patent: 5245790 (1993-09-01), Jerbic
patent: 5245796 (1993-09-01), Miller et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5498196 (1996-03-01), Karlsrud et al.
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5558568 (1996-09-01), Talieh et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5643056 (1997-07-01), Hirose et al.
patent: 5700179 (1997-12-01), Hasegawa et al.
patent: 5707274 (1998-01-01), Kim et al.
patent: 5733175 (1998-03-01), Leach
patent: 5735731 (1998-04-01), Lee
patent: 5769696 (1998-06-01), Lee et al.
Patent Abstracts of Japan--vol. 007, No. 047 (M-196), Feb. 24, 1983 and JP 57 194866 (Shinetsu Kagaku Kogyo KK), Nov. 30, 1982.
Patent Abstracts of Japan--vol. 015, No. 028 (M-1072), Jan. 23, 1991 and JP 02 269552 (Rodeele Nitta KK;Other: 01), Nov. 2, 1990.

Affiliated with

Also associated with

Rating

Chemical mechanical planarization tool having a linear polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical mechanical planarization tool having a linear polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical planarization tool having a linear polishing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2048573