Chemical-mechanical planarization tool force calibration...

Details Chemical-mechanical planarization tool force calibration... Chemical-mechanical planarization tool force calibration...

2006-05-09

2006-05-09

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S009000, C451S041000, C073S001150

Reexamination Certificate

active

07040955

ABSTRACT:
The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending on the wafer carrier configuration, to determine a unique calibration in real time for the particular wafer carrier that is being tested and used during the polishing process.

REFERENCES:
patent: 5916009 (1999-06-01), Izumi et al.
patent: 6083082 (2000-07-01), Saldana
patent: 6241578 (2001-06-01), Togawa et al.
patent: 6315634 (2001-11-01), Jensen et al.
patent: 6766679 (2004-07-01), Judd et al.

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