Chemical mechanical planarization system and method therefor

Details Chemical mechanical planarization system and method therefor Chemical mechanical planarization system and method therefor

1997-11-03

1999-08-31

Utech, Benjamin

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, 438693, H01L 21302

Patent

active

059453460

ABSTRACT:
A chemical mechanical planarization tool that reduces a volume of polishing chemistry used in a wafer polishing process includes a rinse bar (87) for removing polishing chemistry and particulates from a polishing media and a slurry measurement system (84) for regulating a pump (83) of a slurry delivery system. A volume of the slurry delivery system is reduced to less than 100 milliliters. Approximately a minimum volume of polishing chemistry for polishing a single wafer is dispensed during each wafer polishing process of a wafer lot. During each wafer polishing process the slurry delivery system is purged to prevent settling, agglomeration, and hardening of the polishing chemistry. The rinse bar (87) sprays a surface of the polishing media to remove spent polishing chemistry and particulates prior to polishing another semiconductor wafer.

REFERENCES:
patent: 5578529 (1996-11-01), Mullins
patent: 5709593 (1998-01-01), Guthrie et al.
patent: 5804507 (1998-09-01), Perlov et al.

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