Chemical mechanical planarization system

Details Chemical mechanical planarization system Chemical mechanical planarization system

1999-05-26

2000-11-21

Rose, Robert A.

Abrading

Machine

Combined

451 56, 451444, B24B 5300

Patent

active

061495085

ABSTRACT:
A chemical mechanical planarization tool that reduces a volume of polishing chemistry used in a wafer polishing process includes a rinse bar (87) for removing polishing chemistry and particulates from a polishing media and a slurry measurement system (84) for regulating a pump (83) of a slurry delivery system. A volume of the slurry delivery system is reduced to less than 100 milliliters. Approximately a minimum volume of polishing chemistry for polishing a single wafer is dispensed during each wafer polishing process of a wafer lot. During each wafer polishing process the slurry delivery system is purged to prevent settling, agglomeration, and hardening of the polishing chemistry. The rinse bar (87) sprays a surface of the polishing media to remove spent polishing chemistry and particulates prior to polishing another semiconductor wafer.

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patent: 5804507 (1998-09-01), Perlov et al.
patent: 5916010 (1999-06-01), Varian et al.
patent: 5957757 (1999-09-01), Berman
patent: 6053801 (2000-04-01), Pinson et al.

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