Chemical-mechanical planarization pad having end point...

Details Chemical-mechanical planarization pad having end point... Chemical-mechanical planarization pad having end point...

2011-07-26

2011-07-26

Rose, Robert (Department: 3727)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S041000

Reexamination Certificate

active

07985121

ABSTRACT:
A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.

REFERENCES:
patent: 5605760 (1997-02-01), Roberts
patent: 5893796 (1999-04-01), Birang et al.
patent: 5984769 (1999-11-01), Bennett et al.
patent: 6045439 (2000-04-01), Birang et al.
patent: 6068539 (2000-05-01), Bajaj et al.
patent: 6254459 (2001-07-01), Bajaj et al.
patent: 6280290 (2001-08-01), Birang et al.
patent: 6517417 (2003-02-01), Budinger et al.
patent: 6604985 (2003-08-01), Muilenburg et al.
patent: 6621584 (2003-09-01), Pecen et al.
patent: 6676483 (2004-01-01), Roberts
patent: 6752690 (2004-06-01), Fruitman
patent: 6786810 (2004-09-01), Muilenburg et al.
patent: 6832947 (2004-12-01), Manning
patent: 6832949 (2004-12-01), Konno et al.
patent: 6832950 (2004-12-01), Wright et al.
patent: 6860793 (2005-03-01), Budinger et al.
patent: 6910944 (2005-06-01), Birang et al.
patent: 6960120 (2005-11-01), Prasad
patent: 6984163 (2006-01-01), Roberts
patent: 7011565 (2006-03-01), Birang et al.
patent: 7118450 (2006-10-01), Birang et al.
patent: 7195539 (2007-03-01), Turner et al.
patent: 7273407 (2007-09-01), Saikin
patent: 2002/0127951 (2002-09-01), Ishikawa et al.
patent: 2004/0082276 (2004-04-01), Prasad
patent: 2004/0102141 (2004-05-01), Swisher et al.
patent: 2004/0209066 (2004-10-01), Swisher et al.
patent: 2004/0224611 (2004-11-01), Aoi et al.
patent: 2006/0166608 (2006-07-01), Chalmers et al.
patent: 2006/0276109 (2006-12-01), Roy et al.
patent: 941806 (2003-01-01), None
International Search Report dated Oct. 22, 2008 issued in related International Patent Application No. PCT/US0871074.

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