Chemical mechanical planarization pad

Details Chemical mechanical planarization pad Chemical mechanical planarization pad

2011-04-26

2011-04-26

Deo, Duy-Vu N (Department: 1713)

Abrasive tool making process, material, or composition

With synthetic resin

C438S690000, C438S691000, C438S692000, C438S693000

Reexamination Certificate

active

07931713

ABSTRACT:
A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.

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