Chemical mechanical planarization methods

Details Chemical mechanical planarization methods Chemical mechanical planarization methods

2007-06-20

2010-11-02

Eley, Timothy V (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S036000, C451S041000, C451S053000, C451S063000

Reexamination Certificate

active

07824243

ABSTRACT:
A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

REFERENCES:
patent: 6053801 (2000-04-01), Pinson et al.
patent: 6251001 (2001-06-01), Pinson et al.
patent: 6997782 (2006-02-01), Nishi et al.
patent: 7234999 (2007-06-01), Sakurai et al.
patent: 7361076 (2008-04-01), Sakurai et al.

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