Chemical-mechanical planarization machine and method for uniform

Details Chemical-mechanical planarization machine and method for uniform Chemical-mechanical planarization machine and method for uniform

1996-11-06

1999-02-09

Engel, James

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 438959, 451289, B24B 100

Patent

active

058688960

ABSTRACT:
An apparatus and method for uniformly planarizing a surface of a semiconductor wafer and accurately stopping CMP processing at a desired endpoint. In one embodiment, a planarizing machine has a platen mounted to a support structure, an underpad attached to the platen, a polishing pad attached to the underpad, and a wafer carrier assembly. The wafer carrier assembly has a chuck with a mounting cavity in which the wafer may be mounted, and the wafer carrier assembly moves the chuck to engage a front face of the wafer with the planarizing surface of the polishing pad. The chuck and/or the platen moves with respect to the other to impart relative motion between the wafer and the polishing pad. The planarizing machine also includes a pressure sensor positioned to measure the pressure at an area of the wafer as the platen and the chuck move with respect to each other and while the wafer engages the planarizing surface of the polishing pad. The pressure sensor generates a signal in response to the measured pressure that corresponds to a planarizing parameter of the wafer. In a preferred embodiment, the planarizing machine further includes a converter operatively connected to the pressure sensor, a controller operatively connected to the converter, and a plurality of drivers operatively connected to the controller and positioned in the mounting cavity.

REFERENCES:
patent: 4356055 (1982-10-01), Montier
patent: 4884941 (1989-12-01), Kazerooni
patent: 5185957 (1993-02-01), Mizuguchi et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5498199 (1996-03-01), Karlsrud et al.

Affiliated with

Also associated with

Rating

Chemical-mechanical planarization machine and method for uniform does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical-mechanical planarization machine and method for uniform, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-mechanical planarization machine and method for uniform will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1946003